silicon-carbon (si:c) source/drain,process
Tensile stress for nFETs.
1,106 technical terms and definitions
Tensile stress for nFETs.
Silicon layer on insulator.
Most common wafer orientation.
Alternative orientation.
Another orientation.
Silicone causing issues.
Silver recovery from photographic and plating processes reclaims precious metal.
Conductive die attach.
Train in simulation then deploy to real robot.
Attention without additional parameters.
Contrastive learning framework using data augmentation for visual representations.
Preserve pairwise similarities.
Simple masked image modeling.
Simple masked image modeling.
Create SOI by oxygen implantation.
Simple Heterogeneous Graph Network efficiently processes heterogeneous graphs through relation-aware message passing.
Simpler is better. Reduce prompt complexity, model size, system components. Easier to debug and maintain.
Depth profile of elemental composition by sputtering and analyzing ions.
Simple Siamese network for self-supervised learning.
Global optimization technique.
Simulation generates synthetic training data. Game engines, physics sims create diverse scenarios for robotics, vision.
Simulation generates synthetic training data. Sim-to-real gap is challenge. Domain randomization helps.
Build map while tracking position.
Noise from many signals switching together.
One row of pins.
Component whose failure stops production.
Single sampling makes accept-reject decisions based on single sample from lot.
Single source risk arises from dependence on one supplier for critical materials or components creating vulnerability to supply disruptions.
Multiple GPUs in one machine.
Process one unit at a time.
Process one wafer at a time for tight control.
Clean rinse and dry one wafer at a time for tighter control.
Containers for HPC environments.
Fixed sinusoidal position functions.
Silicon oxynitride IL.
Use periodic activations for INR.
Test after installation.
Flatness within small measurement site.
Six big losses are breakdowns setup time small stops reduced speed startup defects and quality defects.
Categories reducing OEE.
3.4 defects per million opportunities.
Six Sigma is data-driven approach to eliminate defects achieving 3.4 DPMO.
Quality methodology targeting 3.4 defects per million.
Recognize actions from pose sequences.
Generate sketch-like images.
Ensure signals arrive at same time.
Skew is timing difference between related signals affecting differential signaling and bus synchronization.
Skill discovery in RL learns diverse reusable behaviors without rewards through information-theoretic objectives.
Skills matrices track employee competencies identifying training needs.
Skin effect concentrates high-frequency current near conductor surfaces increasing effective resistance.