shine, manufacturing operations
Shine maintains cleanliness revealing abnormalities and potential problems.
1,106 technical terms and definitions
Shine maintains cleanliness revealing abnormalities and potential problems.
Ship authorization approves finished wafers for delivery to customers.
Recombination via traps.
Shop floor control manages work flow and resource allocation in real-time.
Quantum factorization algorithm.
Tests using partial process.
Control charts for low volume.
Short-term capability estimates intrinsic process variation from rational subgroups.
Capability over brief period.
Within-day fluctuations.
Shortage management allocates limited materials across competing demands prioritizing critical needs.
Insufficient supply to meet demand.
Learning simple rules that fail to generalize.
Process quickest jobs first.
Shortest processing time dispatching selects lots with minimal operation duration.
Change requires many small edits.
Disperses gases uniformly across wafer in CVD chamber.
Reduced pitch SOP.
Efficient grouped convolutions with shuffle.
ShuffleNet uses channel shuffle operations between grouped convolutions enabling cross-group communication.
Shared mask for multiple small designs.
Small-volume prototype run using MPW.
Learn similarity by training on pairs of examples.
Silicon carbon oxygen hydrogen low-k material.
Side effects are unintended consequences of optimizing specified objectives.
Low-energy twin boundary.
Statistical analysis of variations.
Sigma level quantifies process capability as number of standard deviations fitting within specifications.
Process capability in standard deviations.
Signal integrity simulation predicts waveform quality analyzing distortion jitter and crosstalk.
Maintaining signal quality during transmission.
Metric for robustness.
Signal-to-noise ratios measure robustness by comparing target signal to variation.
Ratio of signal to noise.
Identify characteristic failure patterns.
Signature analysis identifies characteristic spatial patterns in wafer maps corresponding to specific defect types.
Use path signatures for sequence modeling.
Signed distance functions implicitly represent surfaces as zero level sets of distance fields.
Distance to surface.
Represent shapes as distance to surface.
Significance levels specify Type I error probability for hypothesis testing.
Silhouette scores measure clustering quality for individual observations.
Unwanted silicide breakup at high temperature.
Unintended silicide connecting features.
React metal with silicon for low resistance.
Silicidation forms low-resistance metal silicide on source drain and gate regions through reaction between metal and silicon.
Thyristor-based ESD protection.
Alloy of Si and Ge for high-performance transistors.
Silicon substrate connecting multiple dies.
Silicon interposers use semiconductor substrate enabling fine-pitch routing between dies.