thermal pad, thermal management
Thermal pads are pre-formed compliant materials providing mechanical compliance and thermal conductivity for interface thermal management.
653 technical terms and definitions
Thermal pads are pre-formed compliant materials providing mechanical compliance and thermal conductivity for interface thermal management.
Thermal resistance networks model heat paths through series and parallel thermal resistances.
Opposition to heat flow.
Thermal runaway occurs when temperature increases cause higher power dissipation leading to uncontrolled temperature rise and potential device failure.
Model heat distribution.
Thermal simulation uses computational fluid dynamics and finite element methods to predict temperature distributions in packages and systems.
Calculate temperature distribution.
Separate via thermal differential.
Large thermal contact area.
Stress from thermal expansion mismatch.
Thermal test chips contain heating elements and temperature sensors for measuring thermal resistance.
Thermal test vehicles are specialized structures with embedded sensors for thermal characterization and model validation.
Thermal time constant characterizes exponential temperature response to step changes in power.
TSV for heat conduction.
Vias for heat transfer.
Couple thermal and electrical models.
Thermal emission over barrier.
Combination of thermal and field emission.
Thermistors are temperature-sensitive resistors with high sensitivity.
Bond using heat and pressure.
Thermocouples generate voltage proportional to temperature for measurement.
Use heated tool for bonding.
Thermoelectric coolers use Peltier effect to actively pump heat enabling sub-ambient temperatures.
Thermographic inspection detects abnormal temperatures indicating electrical or mechanical problems.
Measure temperature via reflectance changes.
Theta-JA is junction-to-ambient thermal resistance encompassing package case and ambient contributions determining steady-state junction temperature.
Theta-JC quantifies thermal resistance between junction and case typically measured in degrees Celsius per watt for thermal characterization.
Thevenin termination uses two resistors to supply and ground providing matched impedance with bias.
Ensure even thickness.
Alternative thin QFP.
Thin and fine pitch.
Thinner version of SOP.
Manage wafer thinning accurately.
Thompson sampling for recommendations samples item quality from posterior distributions for exploration-exploitation balance.
Bayesian approach to exploration-exploitation.
Group of threads executing together.
Threads enable parallel execution on multiple cores. GIL limits Python. Use multiprocessing or native.
Dislocations extending through film.
AI helps threat modeling. Identify attack vectors.
Specific augmentation recipe for ViT.
3D reconstruction of doping.
Threshold voltage adjustment implants tune transistor turn-on voltage to meet circuit requirements.
Adjust Vt through doping or work function.
Vth differences across devices.
Insert leads into PCB holes.
Via through interposer.
Expose TSV ends after thinning.
Through-silicon vias create vertical electrical connections through silicon substrate.
Throughput accounting measures financial performance emphasizing throughput rather than traditional cost metrics.
Financial metrics for TOC.