background signal, metrology
Signal with no analyte present.
23 technical terms and definitions
Signal with no analyte present.
Pattern wafer back surface.
Time and temperature for drying.
Remove moisture before reflow.
Ultrasonic wire bonding with ball.
Solder balls on package bottom.
ARC layer between substrate and resist.
Size of solder balls.
Spacing between balls.
Systematic error in measurement.
Self-assembling materials for sub-resolution patterning.
Energy per unit area of bond.
Analyze bonded interface quality.
Mechanical strength of wafer bond.
Mechanical strength of bond.
Create SOI by wafer bonding.
Precisely align wafers before bonding.
Cyclic etch-passivation for deep holes.
CD vs focus relationship.
Measure voltage at which junction fails.
Different illumination modes.
Inspect wafer using reflected light to find defects.
Loose components.