vacuum packaging, packaging
Package under vacuum.
23 technical terms and definitions
Package under vacuum.
Remove air from package.
Hall measurement on arbitrary shape.
Measure sheet resistance of films.
Collect surface contaminants for analysis.
Allow pressure equalization.
Allow air escape.
Miniaturized outline package.
Voltage-current probe for plasma impedance.
Series of vias to test reliability.
Selective via removal for routing flexibility.
Form TSV before bonding.
Form TSV after bonding.
Form TSV during intermediate step.
Vertical connection between metal layers.
Prevent mechanical disturbances.
Simulate entire process flow before manufacturing.
Virtual metrology predicts measurements from process data reducing physical measurement needs.
Predict measurements from tool sensor data.
Predict metrology results from tool sensor data without physical measurement.
Identify defects in bond.
Air pockets in compound.
Detect electrical state using SEM.