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Glossary

33 technical terms and definitions

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Vacuum Packaging

packaging

Vacuum packaging is the package sealing process that encloses devices under reduced pressure to control damping, contamination, and long-term stability - it is critical for many…

Vacuum Sealing

packaging

Vacuum sealing is the packaging process that removes air from sealed bags to reduce moisture and oxidation exposure during storage and shipment - it supports long-term protection…

Vapor Phase Decomposition

vpd, metrology

Vapor Phase Decomposition (VPD) is the sample preparation technique that concentrates metallic contamination from an entire 300 mm wafer surface into a single microliter droplet…

Vcsel Wafer Probe Test Yield Prediction with Machine Learning

vcsel wafer probe test yield prediction machine learning, vcsel wafer, probe test yield, dbr vcsel, vcsel wafer probe test yield prediction, vcsel wafer probe, wafer probe test

VCSEL Wafer Probe Test Yield Prediction with Machine Learning Introduction & Motivation VCSEL Wafer Probe Test Yield Prediction with Machine Learning addresses a central problem…

Vent Holes

packaging

Vent holes is the engineered openings in package or cap structures that allow controlled gas exchange between cavity and ambient environment - they are used when devices require…

Verification

chip verification, design verification, uvm, formal verification

Verification is the disciplined process of demonstrating that a chip design satisfies its specification before manufacturing makes mistakes expensive and permanent. It spans…

Vertical Transistor Structures

vertical fet fabrication, vertical channel transistor, vertical gaa device, vertical transistor density

A vertical transistor turns the current path on its side relative to a conventional planar or lateral gate-all-around device: instead of carriers flowing horizontally between…

Very Small Outline Package

vsop, packaging

Very small outline package is the compact leaded package family with reduced body dimensions for high-density board layouts - it targets applications where standard outline…

Vi Probe

metrology

A VI (Voltage-Current) probe is a diagnostic sensor that measures the RF voltage and current waveforms at the input to a plasma chamber, enabling determination of plasma…

Via

via resistance, interconnect via, copper via, contact via, via resistance scaling, beol via, dual damascene via, ruthenium via, barrierless via, lithography

Via resistance is the electrical resistance encountered by current flowing vertically between adjacent metal interconnect levels through a conductive plug, encompassing the bulk…

Via Chain

metrology

Via chain is a series of stacked vias for reliability testing — multiple vertical interconnects connected in series to characterize via resistance, uniformity…

Via Contact Etch

high aspect ratio etching, reactive ion etch selectivity, etch stop layer, contact hole patterning

Via and Contact Etch Process — Via and contact etch processes create the vertical connections between metal layers and between the first metal level and transistor terminals…

Via Cut

lithography

Via cut is a lithography and etch technique used in advanced semiconductor back-end-of-line (BEOL) processing to selectively remove unwanted vias (vertical connections between…

Via-First TSV

advanced packaging, through silicon via, feol tsv, 3d integration

Through-Silicon Vias are the vertical conductive interconnect pillars that traverse the bulk silicon substrate to establish high-density, low-latency electrical connections…

Via-Last TSV

advanced packaging, through silicon via, tsv reveal, 3d packaging

Through-Silicon Vias are the vertical conductive interconnect pillars that traverse the bulk silicon substrate to establish high-density, low-latency electrical connections…

Via-Middle TSV

advanced packaging, through silicon via, copper tsv, 3d integration

Through-Silicon Vias are the vertical conductive interconnect pillars that traverse the bulk silicon substrate to establish high-density, low-latency electrical connections…

Via-Middle TSV

business & strategy, through silicon via, 3d packaging

Through-Silicon Vias are the vertical conductive interconnect pillars that traverse the bulk silicon substrate to establish high-density, low-latency electrical connections…

Vibration Isolation

metrology

Vibration isolation is the prevention of mechanical disturbances from reaching sensitive semiconductor metrology instruments — essential because sub-nanometer measurements on…

Video Codec Chip H.265 H.266

hevc avs3 av1 hardware encoder, video encode decode asic, codec pipeline architecture, cabac entropy coding chip

Video Codec Chip Design: H.265/H.266 Hardware Encoder/Decoder — specialized ASIC for efficient video compression supporting 8K HDR streaming with <10 pJ/bit power efficiency Video…

Virtual Fabrication

simulation

Virtual Fabrication is the computational simulation of complete semiconductor process flows — modeling every deposition, etch, implant, CMP, and thermal step in sequence…

Virtual Metrology

metrology

Virtual metrology predicts wafer measurement results from process tool sensor data without physical measurement, enabling faster feedback and reduced metrology cost. Concept…

Virtual Metrology

vm, metrology

Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…

Virtual Metrology

manufacturing operations

Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…

Virtual Metrology Cross Chamber Transferability Prediction Machine Learning

virtual metrology cross-chamber transferability prediction, virtual metrology cross-chamber, metrology cross-chamber transferability, virtual metrology

Virtual Metrology Cross-Chamber Transferability Prediction with Machine Learning Introduction & Motivation Virtual Metrology Cross-Chamber Transferability Prediction with Machine…

Virtual Metrology for Semiconductor Manufacturing

virtual metrology semiconductor manufacturing, virtual metrology, metrology semiconductor, virtual metrology semiconductor, metrology semiconductor manufacturing, semiconductor manufacturing

Virtual Metrology for Semiconductor Manufacturing Introduction & Motivation Virtual Metrology for Semiconductor Manufacturing addresses a central problem in in-line quality…

Virtual Metrology Model Calibration Drift Prediction Machine Learning

virtual metrology model calibration drift prediction, virtual metrology model, metrology model calibration, model calibration drift, calibration drift prediction

Virtual Metrology Model Calibration Drift Prediction with Machine Learning Introduction & Motivation Virtual Metrology Model Calibration Drift Prediction with Machine Learning…

Virtual Metrology Model Drift Monitoring Prediction with Machine Learning

virtual metrology model drift monitoring prediction machine learning, virtual metrology, model drift monitoring, apc, virtual metrology model, metrology model drift

Virtual Metrology Model Drift Monitoring Prediction with Machine Learning Introduction & Motivation Virtual Metrology Model Drift Monitoring Prediction with Machine Learning…

Vision Processor

vision processing unit, computer vision accelerator, adas vision chip

Vision processor definition and engineering boundary. is a specialized processor that transforms camera pixels into enhanced images or real-time perception results. It couples…

Void Detection in Bonded Wafers

advanced packaging

Void Detection in Bonded Wafers is the non-destructive inspection process that identifies unbonded regions (voids) trapped at the interface between bonded wafers — using acoustic…

Voids in Molding

packaging, trapped gas void, flow front entrapment, vent design, stress concentration, delamination, thermal conduction loss, moisture ingress, acoustic microscopy inspection

Voids in molding are air or gas pockets trapped inside the encapsulation compound during molding — internal discontinuities that form either because trapped gas has no escape path…

Voltage Contrast Imaging

metrology

Voltage Contrast Imaging is a scanning electron microscope (SEM) technique that visualizes electrical potential differences across semiconductor device surfaces by detecting…

Voltage Regulator on Chip

ldo regulator, on die voltage regulator, integrated voltage regulator, ivr

On-Chip Voltage Regulators are integrated power management circuits that generate and regulate supply voltages directly on the processor die — enabling fine-grained per-core…

Voltage Regulator

voltage regulator on chip, LDO regulator IC, switched capacitor regulator, PMIC design

A voltage regulator converts an imperfect supply into the controlled rail that a circuit can safely use. Its job is broader than producing a nominal voltage. It must reject input…