ultraviolet photoelectron spectroscopy, ups, metrology
Measure valence band and work function.
11 technical terms and definitions
Measure valence band and work function.
Breakdown of uncertainty sources.
Particles in underfill.
Material reducing CTE mismatch effects.
Material filling gaps around TSV.
Fill gap under flip-chip.
Trapped air in underfill.
Epoxy material filling gap between die and substrate for reliability.
Standard for chiplet interconnection.
Inspect bare wafers.
Use UV excitation for surface sensitivity.