Dual In-Line Package
dip, packaging
Dual in-line package is the through-hole package with two parallel rows of straight leads designed for socketing or PCB insertion - it remains important in legacy, prototyping…
161 technical terms and definitions
dip, packaging
Dual in-line package is the through-hole package with two parallel rows of straight leads designed for socketing or PCB insertion - it remains important in legacy, prototyping…
tensile stress liner nmos, compressive stress liner pmos, stress liner deposition, cesl nitride film
Channel strain engineering, embedded silicon-germanium (eSiGe) source/drain stressors, and dual contact etch stop liners (DSL / CESL) constitute the primary material-enhancement…
production
Dummy wafer: a non-product wafer that does a real process job. A dummy wafer is used to establish a qualified load, condition equipment or support a tool operation without…
duv, deep ultraviolet, lithography
DUV (Deep Ultraviolet) lithography uses short-wavelength ultraviolet light — primarily 193nm (ArF) and 248nm (KrF) — to pattern semiconductor wafers, and has been the workhorse…
metrology
Dynamic Range is the ratio between the largest and smallest measurable values — spanning from the detection limit (or quantification limit) at the low end to the saturation…
metrology
Dynamic SIMS is the high-flux primary ion beam mode of Secondary Ion Mass Spectrometry used for depth profiling, where a continuous, high-current primary ion beam (O2^+ or Cs^+)…
low power chip design, dvfs controller, power management ic, pmic frequency scaling
Dynamic Voltage and Frequency Scaling (DVFS) is the critical active power management technique in modern SoCs and microprocessors that dynamically adjusts the operating voltage…
plasma etching, RIE, reactive ion etching, ICP etching, plasma physics and etching
Dry etching is the Coburn–Winters synergy: ion bombardment perpendicular to the wafer surface enhances the chemical etch rate of silicon in XeF from 1 nm/min to 55 nm/min — a 9.2…
non contact exposure, projection lithography 1973
Define the Mask-to-Wafer Working Gap Removing physical contact meant introducing a deliberate working gap between the mask and the wafer, with an optical system filling that gap…
perkin elmer micralign, projection lithography 1973
Detail 1:1 Imaging and the Scanning Slit Micralign projected the mask pattern onto the wafer at 1:1 scale, meaning the image on the wafer was the same size as the pattern on…
catadioptric optics, projection lithography 1973
Describe Micralign Model Generations and Refinements Perkin-Elmer did not stop at the original 1973 Micralign design, and refined successive models with improvements…