wat (wafer acceptance test),wat,wafer acceptance test,metrology
Electrical tests on test structures to verify process.
66 technical terms and definitions
Electrical tests on test structures to verify process.
Through-hole soldering method.
Wire bonding without ball.
KOH TMAH etchants.
Optical 3D surface measurement.
Optical method to measure surface topography.
Comprehensive ESD strategy.
Alternative stacked memory interface.
Connect chip to package with wires.
Connect die pads to package leads with thin wires.
Wires drooping.
Wires displaced by flow.
Wires moving during molding.
Thickness variation across single wafer after CMP.
Variation across single wafer.
Standard used in daily operations.