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Glossary

3,538 technical terms and definitions

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Showing page 26 of 71 (3,538 entries)

Glass Substrate Packaging

glass interposer, glass core substrate, TGV glass packaging

Glass Substrate Packaging is the use of ultra-thin glass panels as the core interposer or packaging substrate material instead of conventional organic laminates or silicon…

Global Flatness

metrology

Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…

Globalfoundries

GlobalFoundries GF, GF foundry, 22FDX, GlobalFoundries silicon photonics, GlobalFoundries RF

GlobalFoundries. is a pure-play semiconductor foundry focused on differentiated and essential technologies rather than pursuing each minimum-pitch logic generation. Formed…

Golden Wafer

metrology

A golden wafer is a reference wafer with precisely known and stable properties used to calibrate metrology tools, verify equipment performance, and ensure measurement consistency.…

Golden Wafer Baseline Drift Prediction with Machine Learning

golden wafer baseline drift prediction machine learning, golden wafer, baseline drift prediction, golden wafer baseline drift prediction, golden wafer baseline, wafer baseline

Golden Wafer Baseline Drift Prediction with Machine Learning Introduction & Motivation Golden Wafer Baseline Drift Prediction with Machine Learning addresses a central problem…

GPU Nvlink Interconnect

nvswitch all to all, nvlink 4.0 bandwidth, nvlink c2c chip to chip, nvidia dgx h100 nvlink

NVLink and NVSwitch GPU Interconnects: High-Bandwidth All-to-All GPU Networking — specialized interconnect technology enabling 900 GB/s per-GPU communication for tightly-coupled…

GPU vs CPU

difference between gpu and cpu, gpu vs cpu chip, what is the difference between a cpu and gpu, cpu vs gpu explained, why gpu for ai

A CPU and a GPU are both chips built by the same lithography and fabrication process, but they are laid out around opposite bets on what kind of work matters most: a CPU devotes…

Granite Surface Plate

metrology

Granite surface plate is a precision-ground natural stone slab providing an extremely flat reference surface for dimensional measurements — the fundamental metrology reference…

Graph Theory

discrete mathematics graphs, vertices and edges, graph traversal, graph connectivity, shortest path algorithms, graph coloring, network flow, graph theory semiconductor

Graph theory studies systems by separating the things that exist from the relationships that connect them. A graph can represent nets joined by components, process steps…

Graphene Transistor Fabrication

graphene bandgap engineering, graphene contact resistance, graphene high frequency, graphene rf applications

A graphene transistor channel is built from a single atomic layer of carbon atoms arranged in a two-dimensional hexagonal lattice, held together by sp2 covalent bonds with…

Grazing Incidence Saxs

gisaxs, grazing-incidence small-angle x-ray scattering, grazing incidence small angle x-ray scattering, gisaxs thin film, gisaxs metrology

Grazing-incidence small-angle X-ray scattering turns weak nanoscale density variations at a surface or within a thin film into a two-dimensional reciprocal-space pattern.…

Greek Cross

metrology

Greek cross is a sheet resistance measurement pattern — a symmetric four-point probe structure shaped like a plus sign (+), providing more accurate sheet resistance measurements…

Groq

cerebras, custom chip

Custom AI Accelerator Chips AI Chip Landscape Company Chip Focus NVIDIA H100, B200 General AI Groq LPU Low-latency inference Cerebras WSE-3 Largest chip, training Google TPU v5…

Gross Die per Wafer Forecast Prediction Machine Learning

gross die per wafer forecast prediction, gross die per, die per wafer, per wafer forecast, wafer forecast prediction, gross die, die per, per wafer, wafer forecast, forecast prediction

Gross Die Per Wafer Forecast Prediction with Machine Learning Introduction & Motivation Gross Die Per Wafer Forecast Prediction with Machine Learning addresses a central problem…

Rinse and Dry

grown junction 1951 rinse and dry, mobile ion contamination semiconductor surface, deionized water rinse electrolyte residue, grown junction transistor reliability drift

Rinse and Dry: The Last Chance to Remove Something That Will Move Later Every failure mode this process has addressed so far has been immediate — a wrong concentration, a cracked…

Gull-Wing Leads

packaging

Gull-wing leads is the outward and downward bent lead form used in many surface-mount packages to create visible solder joints - they offer good inspectability and compliance…

Haadf Imaging

high-angle annular dark field, stem imaging, metrology

Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…

Half-Pitch

half pitch, lithography half-pitch, rayleigh half-pitch, dense grating half-pitch, minimum half-pitch, sub-euv half-pitch, sadp half-pitch, lithography

Half-pitch is half of the center-to-center distance between repeating equal lines and spaces in a dense grating on a semiconductor wafer, serving as the historical gold-standard…

Hall Effect Measurement

hall coefficient, carrier density measurement, hall mobility, semiconductor hall measurement

Hall effect measurement separates the two electrical properties that ordinary resistance leaves multiplied together: how many mobile charge carriers a semiconductor contains…

Ion Implantation

halo implant, pocket implant, dopant, channeling, annealing, amorphization, junction depth, semiconductor doping, beamline implanter, doping

Ion implantation, atomic doping profile engineering, and advanced millisecond thermal annealing constitute the fundamental semiconductor manufacturing disciplines required…

Hamiltonian Mechanics

canonical hamiltonian dynamics, phase space mechanics, poisson bracket mechanics, symplectic mechanics, hamiltonian mechanics semiconductor, engineering hamiltonian modeling

Hamiltonian mechanics represents a dynamical system as flow through phase space, with generalized coordinates and canonical momenta treated on equal footing. It is equivalent…

Handle Wafer

SOI wafer stack, buried oxide thermal bottleneck, FD-SOI back gate, RF-SOI high resistivity, CZ bulk silicon, SOI cost structure, mechanical support substrate, body biasing, SOI manufacturing

The handle wafer is the thick, mechanically robust silicon substrate that forms the structural foundation of an SOI (silicon-on-insulator) wafer stack, providing nothing but…

Handle Wafer

advanced packaging

Handle Wafer is a permanent substrate that provides structural support to a thin device layer in bonded wafer structures — unlike a temporary carrier wafer that is removed after…

Hard Bake

lithography

Hard bake is the post-development thermal treatment used when a patterned resist must become mechanically tougher, less permeable, or more resistant to a subsequent wet or plasma…