setup wafers, production
First wafers after recipe change.
923 technical terms and definitions
First wafers after recipe change.
Measure resistance uniformity across wafer.
Tests using partial process.
Reduced pitch SOP.
Ratio of signal to noise.
Identify characteristic failure patterns.
Silicon substrate connecting multiple dies.
Silicon layer on insulator.
Conductive die attach.
Depth profile of elemental composition by sputtering and analyzing ions.
One row of pins.
Process one wafer at a time for tight control.
Clean rinse and dry one wafer at a time for tighter control.
Flatness within small measurement site.
Characterize nanostructures.
Standard SOP variant.
Surface mount with gull-wing leads.
Co-optimize illumination source and mask pattern.
Bake resist after coating to remove solvent.
Create solder bumps on die.
Small solder ball on die pad for flip-chip bonding.
Use solder for attachment.
Melt solder to form connection.
Pattern of failures on wafer.
Map optical properties across wafer.
Measure over range of wavelengths for multi-layer analysis.
Measure CD from wavelength-dependent scattering.
Capacitance-voltage measurement for interface states.
Measure resistivity vs depth.
Tiny features on mask to improve main pattern.
Consistency over time.
Consistency of measurements over time.
Chemical treatment to enhance defects.
Gap between package and board.
Surface analysis with minimal damage.
TEM with scanning beam.
Lithography tool that steps and repeats the reticle pattern across the wafer.
Second connection point.
Random failures due to resist chemistry.
Random variations from photon shot noise and resist.
Energy loss/gain in Raman scattering.
Vertical leads.
Relate Raman shift to stress.
Mechanical surface roughness measurement.
Ecosystem for chiplet-based design.
Characterize surface properties.
Mount on PCB surface.
Measure band bending and carrier diffusion.
Measure minority carrier diffusion length.
Clean and activate surfaces before bonding.